WiPDA-Asia 2027

WiPDA-Asia 2027

Call for papers

Topics, deadlines, and how the review works.

WiPDA-Asia 2027 invites four-page abstracts on original work in wide bandgap power devices, their packaging and their applications. Accepted papers are presented orally or as posters, and the final manuscripts are submitted to IEEE Xplore.

Download the call for papers (PDF)

Topics

  • Device structures and fabrication techniques
  • Device characterization and modelling
  • Advanced packaging solutions
  • Robustness and reliability studies
  • Novel and advanced applications (transportation, data centres, SSTs)
  • Ultra wide-band-gap materials
  • Gate drivers and auxiliary circuits
  • High-efficiency, high-power-density converters
  • AI and machine learning for WBG devices, packaging and converters

Important dates

Deadlines close at 23:59 anywhere on Earth.
Abstract submissionNovember 15, 2026
Review notificationJanuary 10, 2027
Final submission and registrationFebruary 12, 2027

How to submit

  1. Write a four-page abstract with the Word template: one page of text, up to two pages of figures, one page of references.
  2. Convert it to PDF.
  3. Upload it through the submission system.

The format and what reviewers look for are described on the paper submission page.